Description
Provides a quick and easy way to rework boards fitted with surface mount parts, including RoHS certified products. It works by blowing 320 watts of heated air onto the board your are working on, melting the solder on the SMD pads in the process. It is fully temperature adjustable between 160°C and 480°C. The high flow air pump blows up to 24 litres per minute and is also adjustable depending on the desoldering temperature being used. Includes four nozzles to aid in desoldering a wide variety of SMD components (including chips such as SOIC, CHIP, QFP, PLCC, BGA.
In the Box
1 x Rework station
4 x Nozzles
1 x Power cord (approved)
1 x User manual
Features
- Low vibration air pump
- Suits leaded & lead free solder (RoHS)
- Sturdy all metal housing
- Rapid heat up
- Long service life
- Includes 4 nozzles to suit SOIC, CHIP, QFP, PLCC, BGA and more
- Individual temperature & air flow adjustments
- Auto fan cooling extends tip life
- ESD safe
- Energy authority approved
- Burn resistant lead
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