A mildly activated, resin-based flux formulation developed for a wide range of applications, leaving a pin-probable residue. The superior wetting ability results in bright, smooth, shiny solder joints. It also has very low post-process residue, which remains crystal clear and probable even at the elevated temperatures required for today's lead free solders. Reduces or eliminates voiding and also offers high humidity tolerance and a chemistry developed for use in air reflow.
• 10g syringe pack
• Suitable for lead-free solders
• Probable residue
• 10g syringe pack
• Suitable for lead-free solders
• Probable residue
Product Dimensions
| Length | 23.5 cm |
|---|---|
| Width | 9.0 cm |
| Height | 3.0 cm |
Packaged Dimensions
| Packaged Dimensions | 23.5cm(Length) x 9.0cm(Width) x 3.0cm(Height) |
|---|
![SOLDERING PASTE [FLUX]](https://cdn11.bigcommerce.com/s-jgf6dtkaf1/images/stencil/729x729/products/44278/56056/zd170__76766.1784429640.jpg?c=1 "SOLDERING PASTE [FLUX]")