Specifications
ZALMAN has introduced a new high-performance thermal interface material called the ZM-STC11, expanding its cooling product lineup with a silicone-based thermal paste designed for desktop processors, workstation systems, and general PC cooling applications. The company positions the new compound toward users looking for improved thermal transfer efficiency, long operational lifespan, and easier application characteristics. The ZM-STC11 uses a formulation based on dimethylpolysiloxane combined with zinc oxide and aluminum oxide. According to ZALMAN, the compound delivers a thermal conductivity rating of 18 W/m·K, placing it within the higher-performance category of commercially available thermal interface materials for enthusiast and professional desktop systems. In addition to conductivity, the company is emphasizing viscosity optimization. The thermal compound is specified at 2.6 g/cm³, which ZALMAN describes as an ideal balance between spreadability and long-term contact consistency. Thermal paste viscosity plays an important role in maintaining proper contact between the processor heat spreader and cooler surface, particularly during extended thermal cycling and sustained high-load operation.
